Flexible Electronics News

Optomec to Present New Micro Dispense Process Using Aerosol Jet Printer for High Density 3D Packaging

Aerosol Jet Micro Dispense Printing of new conductive epoxy for small feature, die attach applications will be highlighted

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Optomec announced that Dr. Mike Renn, Optomec advanced applications lab director, will give a presentation titled “Aerosol Jet Printing of Conductive Epoxy for 3D Packaging” in the Advanced Materials track at the Pan Pacific Microelectronics Symposium in Hawaii. The conference will be held Jan. 22-24 at the Makena Beach and Golf resort in Maui. Dr. Renn will discuss how traditional dispensing technologies are typically limited to feature sizes above 100 microns and have limited 3D capab...

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